2010-299 – Molecular breast imaging (MBI) is a molecular imaging technique that can be used for the detection of breast cancer. MBI can detect breast tumors not visible on mammography or ultrasound. MBI images usually take 5-10 minutes to acquire 1 view. A slant-hole collimator can be used to estimate tumor depth and enable tumor biopsy using a radiolabeled guide. However, the long imaging time of 5-10... Read More
2010-138 – This invention describes a mathematical method for reliably describing audiometric configuration and classifying the severity of hearing impairment. It has been shown to accurately correlate with the patient self reports of hearing difficulty better than any other classification method currently used in clinical audiology.
2010-137 – This invention describes a novel calculation called the Speech Transmission Index based Social Hearing Index (STI-SHI or social hearing index for short). The social hearing index can be calculated using standard pure tone hearing threshold data and supra-threshold measures of speech intelligibility. The STI-SHI can be useful in refining the legal definition of hearing disability and will also... Read More
2009-366 – A method and system for producing 3-dimensional ultrasound images of a patient’s breast and also producing planar emission images from a radiopharmaceutical is described. The system allows perfect co-registration of both the ultrasound image and the emission image, thereby allowing comparison of anatomical and functional features of the breast tissue. The system comprises 3 primary components... Read More
Self-Contained Semi-Active Cooling Mechanism for Very High Power Density Integrated Circuits and Electronic Modules Using a Reversible Endothermic Chemical Reaction
2005-026 – This invention is a completely self-contained and encapsulated “package” into which a high power integrated circuit (“chip”) such as an amplifier, or an entire subsystem (such as a radar “transmit-receive” module), can be installed to provide the necessary thermal and electrical environment to assure that the chip or multi-chip subsystem works correctly. The packaging approach not only... Read More